The R1 Conjugative Plasmid Increases Escherichia coli Biofilm Formation through an Envelope Stress Response

dc.creator	Xiaole Yang
dc.creator	Qun Ma
dc.creator	Thomas K. Wood
dc.date.accessioned	2019-10-15T15:53:26Z
dc.date.available	2019-10-15T15:53:26Z
dc.date.issued	2008
dc.identifier.issn	0099-2240
dc.identifier.issn	1070-6291
dc.identifier.issn	1098-5336
dc.identifier.uri	https://hdl.handle.net/1969.1/183962
dc.format.extent	1	en
dc.publisher	Applied and Environmental Microbiology
dc.relation.ispartof	1foldr Import 2019-10-08 Batch 13	en
dc.relation.uri	10.1128/AEM.02809-07	en
dc.title	The R1 Conjugative Plasmid Increases Escherichia coli Biofilm Formation through an Envelope Stress Response	en